SiC/Al双面焊的残余应力分析

Residual Stress Analysis of SiC/Al Double-face Weld

运用有限元软件ANSYS对SiC/Al的双面焊过程进行了数值分析.采用高斯圆柱热源模型模拟激光焊源,利用APDL编写循环程序实现热源的移动,得到SiC/Al双面焊过程的温度场分布和冷却后的残余应力场.从平行焊接方向陶瓷侧靠近焊缝处的横向和纵向残余应力分布曲线可见:第一道焊表面(正面)的纵向残余应力在其边缘端均为压应力,并迅速向内转变为拉应力;而第二道焊表面(反面)的纵向残余应力却正好相反,其边缘端均为拉应力,并迅速向内转变为压应力.而横向残余应力均为压应力,最大值分布在两侧.在焊缝两侧,横向与纵向残余应力均发生跳跃变化.

This paper presents an analysis of the double-face weld process of SiC/Al with ANSYS software. The Gauss cylindrical thermal source was adopted to simulate laser solder source, and its movement was realized by ANSYS Parametric code. The temperature field and residual stress field of weld process were obtained. According to the curve of longitudinal and transverse residual stress beside the weld, the longitudinal residual stress σx of the first welding surface was the compressive stress at two edges of the plate and became the tensile stress toward the middle. On the other surface, the distribution of σx was on the contrary to the former. The transverse residual stress ay was compressive with the maximum at two edges of the plate. The jump of σx and a, were found at two sides of the welding line.