摘要
利用快速凝固技术制造出Cu-Ni-Sn-P非晶薄带钎料,将此钎料分别在不同钎焊温度和钎焊时间下与紫铜进行真空钎焊,借助DTA、EPMA分析,探讨了在不同钎焊条件下钎焊接头的显微组织结构,及同成分非晶钎料与普通钎料的润湿性差异。研究表明,与普通钎料相比,非晶钎料润湿性明显提高,钎料与母材的相互扩散和冶金结合增强。
The brazing ribbons of Cu-Ni-Sn-P are prepared by means of rapid solidification technique.Microstructure and wettability of brazed joints which are brazed under different brazing temperatures and holding lime are analyzed using DTA and EPMA measures.The results show that the wettability of the brazing foils is improved greatly,interdiffusion and metallurgy combination between base metal and i＇flier metals are increased.
出处
《电焊机》
2008年第5期22-25,共4页
Electric Welding Machine
