摘要
以TiO2为基体,采用化学共沉淀技术制得复合导电粉末。利用正交试验得到优化的制备条件:复合反应体系组成为m(TiO2)∶m(SnCl4)∶m(SbCl3)=25∶15∶1,pH值为1.5,水解温度60℃,沉积SnCl4和SbCl3的水解产物于TiO2粒子表面,得到的包覆物在700℃下焙烧30 min,制备的复合导电粉末体的电阻率为77Ω.cm,粒径≤200 nm。将导电粉末与粘结树脂经球磨分散制得具有良好流动性的涂布液,在铝箔上能够制备得到电阻率低于108Ω.cm的导电涂层,满足制备有机光导体的要求,涂层表面平滑,无凹凸等缺陷。
The composite conductive powder with titanium dioxide powder covered by SnO2 and Sb203 was prepared by chemical coprecipitation technology. The orthographic tests showed that the optimal preparation condition is m（TiO2 ） ： m （SnCl4） ： m （SbCl3） = 25： 15： 1, pH = 1.5, hydrolysis temperature is 60 ℃ and calcinations temperature of the coprecipitation product is 700 ℃, the volumetric electrical resistivity of the powder is 77 Ω· cm with size below 200 nm. Conductive coating was then prepared on aluminum alloy substrate with phenolic resin as binder. The volume resistivity of the conductive coating could be below 10^8 Ω·cm, meanwhile the surface of the conductive coating was smooth without defect.
出处
《化学工业与工程》
CAS
2008年第3期194-198,共5页
Chemical Industry and Engineering
基金
863计算(2002AA325050)资助项目
天津市应用基础研究计划重点项目(06YFJZJC01600)
关键词
复合导电粉末
化学共沉淀
导电涂层
分散
电阻率
composite conductive powder
chemical coprecipitation
electrical conductive coating
dispersion
resistivity
