六西格玛在F半导体公司BGA产品质量改进的应用

Application of Six Sigma Method on BGA Product Quality Improvement in F Semiconductor Company

BGA(Ball Grid Array球栅阵列封装)是一项被广泛应用的高密度封装技术。对BGA产品制造来说,过程中的最容易出现次品的环节是植球工序。本文采用六西格玛管理的DMAIC流程,通过控制胶量厚度和植球偏移量这两点对提高植球成功率最有影响的因素,对影响BGA产品制造过程中植球工序的设备能力进行了改进,取得良好的效果。

BGA（Ball Grid Array） is a high-density encapsulation technology being widely used. Most of the defects appear at ball attachment process to BGA production process. In this paper, the DMAIC process of Six Sigma method is used to control the glue thickness and ball offset which are the two key factors to affect the ball attachment success. The equipment ability affecting the ball attachment process in BGA production process is improved. Good results are obtained.