钼粉表面化学镀铜工艺研究

Electroless Copper Plating on Molybdenum Powder Surface

采用化学镀方法对平均粒径3μm的Mo粉末进行化学镀铜,探讨了工艺条件对化学镀铜的影响。利用扫描电镜(SEM)对钼粉镀覆前后形貌进行观察;X射线衍射(XRD)对所得复合粉末相组成进行了分析。结果表明:采用化学镀的方法可以成功地获得铜含量(质量分数)为15%～85%的Mo/Cu复合粉末,复合粉末中无Cu2O,表面平滑,但有团聚现象;化学镀铜过程中,pH值的临界值为12,随着pH值增加,镀速加快,但是pH值过高会引起甲醛分解,镀液中pH值的最佳范围在12～13之间;随着温度和甲醛含量的升高,镀速加快,镀液稳定性降低,镀液中甲醛含量和温度最佳范围分别为22～26mL/L,60～70℃。

The Mo powders with an average particle size of 3μm were coated with copper by electroless plating.The influence of plating conditions on the morphology and phase composition of the electroless copper was studied,based on scanning electron microscopic(SEM)and X-ray diffraction(XRD)analyses.The results indicated that Mo/Cu composite powders containing 15%-85% Cu could be prepared by electroless copper plating of the Mo powders.The composite powders had smooth surfaces but showed some signs of agglomeration.The threshold pH value for the electroless copper plating was found to be 12.Namely,the plating rate increased with increasing pH value,but formaldehyde tended to be decomposed at a rather high pH value.Therefore the optimal pH value for the electroless copper plating was recommended as 12-13.Moreover,the plating rate increased with increasing temperature of the plating bath and the concentration of formaldehyde as well,but the stability of the plating bath decreased therewith.And the optimal range of temperature and concentration of formaldehyde was suggested to be 60-70℃ and 22-26 mL/L,respectively.