摘要
利用冷压-烧结技术制备了CuO掺杂的10NiO-NiFe2O4复合陶瓷,研究了CuO掺杂量对10NiO-NiFe2O4复合陶瓷物相组成、显微结构、致密度及导电率的影响。结果表明:当CuO掺杂量为0~12.5%(质量分数)时,烧结样品中主要含有NiO、Cu和NiFe2O4、CuO在氮气气氛下分解为金属Cu,在烧结温度下为液相促进了致密化烧结;1473K烧结时,8.75%CuO掺杂样品的相对密度最大,达到94.43%,比未掺杂样品的相对密度提高了18.16%;当CuO掺杂量为4%时,在1233K温度下样品达到最大导电率5.169S/cm,是未掺杂样品的导电率1.026S/cm的5倍。
The CuO doped 10NiO-NiFe2O4 composite ceramics were prepared with the cold isostatic pressing-sintering process, the effects of CuO content on the phase composition, microstructure,density and electrical conductivity of 10NiO-NiFe2O4 composite ceramics were studied. The results show that the samples are mainly consisted of NiO ,Cu and NiFe2O4 when content of CuO is 0-12.5 % (mass fraction), CuO is decomposed and forms low melting point phase Cu, which is important to accelerate the sintering densification. When sintered at 1473K, the sample doped with 8.75% CuO relatively have the maximum relative density (94.43%), which increases 18. 16% compared with the undoped samples. Moreover, when the CuO content is 4%, the sample of 10NiO-NiFe2O4 composite ceramics relatively have the maximum electrical conductivity(5. 169S/cm), which is 5 times compared with the undoped samples.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2008年第5期757-760,共4页
Journal of Functional Materials
基金
国家重点基础研究发展规划(973计划)资助项目(2005CB623703)
国家自然科学基金资助项目(50474051)