日本电子电镀工业中的化学镀金工艺(一)

Electroless gold plating technics in electronic plating industry in Japan—part one

本文分2部分,介绍了日本电子电镀工业化学镀金工艺。第一部分论述了早期使用的硼氢化钾和DMAB两种镀液体系的组成及反应机理。指出了两种镀液体系存在的问题。提出了提高镀速的8种措施。

The paper is to be published in two parts, introducing the electroless gold plating process in electronic plating industry in Japan. In the first part, the composition and reaction mechanism of two bath systems of potassium borohydride and D＇MAB used in the early period were discussed. Problems existing in the two bath system were presented. Eight kinds of measures improving electroless gold plating rate were suggested.