摘要
从市场角度分析金卡市场的发展趋势;从技术角度剖析BL75R06的内部结构,分析用其做成的非接触卡的架构和工作原理。
This paper analyzes the development trend of Golden Card market from a market perspective and anatomizes the internal structure of BL75R06 from a technical point of view. As well, it analyses the operation principles of the structure of non-contact cards which made of this golden card.
出处
《电子质量》
2008年第5期49-51,共3页
Electronics Quality