叠层CSP封装的振动模糊可靠性分析

Fuzzy Reliability Analysis of Vibration in CSP Package

由于叠层CSP封装的复杂性,其振动特性很难用精确的理论模型表示。同时,由于传统的共振准则没有考虑到系统的变异性和模糊性,导致分析结果与真值具有较大偏差。该文利用有限元法方法建立叠层CSP封装振动分析模型,并求解其振动特性;在此基础上充分考虑系统的模糊性,对振动可靠性模型进行模糊处理,利用模糊理论建立其振动模糊可靠性理论模型。通过算例验证了振动模糊可靠性理论模型的有效性和可行性。

The vibratory characteristic of the chip size package （CSP） is difficult to be abstracted to an accurate academic model because of its complexity, and because the classic resonance rules can not take the fuzziness of resonant region into account, the results of vibration reliability analysis are inaccurate for actual demands possibly, finite element method （FEM） is used to build up the vibration analysis model and analyze. Furthermore, base on the analysis of FEM, an academic fuzzy reliability analysis model of vibration is built up with the help of fuzzy theory. In the end, a calculating example of fuzzy reliability analysis of vibration testifies the proposed method and principle are effective.