摘要
分析了在倒装芯片尺寸、相邻焊球中心之间距离相同的情况下,焊球点满布叉排排列和满布顺排排列对倒装芯片下填充流动的影响。并就焊球点布置密度不同,在顺排和叉排排列两种方式时,用相同的填充时间填充材料流动前端所走过的距离以及其分布情况进行了计算机模拟分析研究。
Investigate the characteristics of flip -chip underfill flow in both staggered arrangement and aligned arrangement with same chip size and distance of border upon of solder bumps. Finite - element method was used in the numerical simulation to solve the flow field and the underfill flow front distribution at the same time about above -mentioned two arrangements.
出处
《电子工艺技术》
2008年第3期134-138,共5页
Electronics Process Technology
基金
广州市科技局科学基金项目(项目编号:2006-J1-CO281)
广州市教育局科技项目(项目编号:2006-62017)
关键词
倒装芯片
满布顺排
满布叉排
焊球点
焊球布置密度
Flip - chip
Full aligned arrangement
Full staggered arrangement
Solder bump
