无铅钎料电迁移可靠性研究进展

Progress of study on electromigration reliability in lead-free solder

随着电子器件焊点尺寸及其间距的日趋减小,电流密度急剧增加,从而引发的电迁移可靠性问题更加显著。电迁移效应的发生,使得在阴极附近出现裂纹和孔洞,在阳极则产生小丘或堆积,从而导致电路短路或断路。介绍了近年来国内外关于无铅钎料合金包括SnAgCu、SnAg、SnZn和SnBi等电迁移研究,对实验的结果、特征及其方案进行了综述和评论。

Along with the size and pitch of the solder joints becoming smaller and smaller, electrical current density increases rapidly, so the electromigration reliability issues get remarkable. When electromigration happens, some voids and cracks appear at the cathode side and some hillocks accumulate at the anode side, and ultimately lead to open circuit or short circuit. Electromigration behavior of some kinds of solder alloys include SnAgCu. SnAg. SnZn. SnBi and so on was summarized, the experimental results, merits and schemes were expounded particularly.