摘要
传统半导体清洗技术无法对硅片上的微小器件间的缝隙和线条进行有效清洗,以超临界二氧化碳为媒体的清洗技术则可克服上述缺点。超临界二氧化碳具有零表面张力、低黏度、强扩散能力和溶解能力等特性,并且无毒无臭、可以循环使用,在下一代半导体清洗和清洗后的干燥过程中有极强的应用前景。提出了一种绿色二氧化碳超流体半导体清洗设备,它可实现超流体清洗和超临界干燥,二氧化碳循环使用,属于新型高效的下一代绿色半导体清洗设备。
Conventional IC cleaning technology could hardly provide effective wafer with subtle microstructure, but this problem would be solved when the cleaning media is substituted by supercritical point carbon dioxide （SCCO2）. SCCO2 is characterized as no surface tension, low viscosity, and high diffusivity, no noxious and recyclable use. This new cleaning technology would be widely used in IC technology due to the mentioned advantages. A green SCCO2 cleaning apparatus is proposed in this paper, and the apparatus could implement supercritical cleanout and desiccation with recyclable CO2.
出处
《电子工业专用设备》
2008年第5期14-17,34,共5页
Equipment for Electronic Products Manufacturing
关键词
表面张力
超临界二氧化碳
清洗和干燥
牺牲层释放
Surface tension
Supercritical point CO2
Clean and dry
Release sacrificial layer
