3WU G W,WEST T E. Hard Porous Pad for Cu CMP[A].Semicon China 2003 CMP Technical Symposium[C].上海,2003.95-110.
4H.Wong et al.“Thermal Stability of Strained Si/Si1-xGex Heterostructures for Advanced Microelectronics Devices,”[].Thin Solid FilmsSympL:Advances in Materials for Si Microelectronics.2004
5M.Hecker,and H.Geisler.“Strain State in Silicon Struc-tures for Microprocessor Technology,”[].Materials Science-Poland.2007
4Mercado, L L, Kuo S-M, et al. Impact of flip-chip packaging on copper/low-k structures [J]. IEEE Transactions on Advanced Packaging, 2003, 26(4): 433-440.
5Yang, D G. Cure-dependent viscoelastic behavior of electronic packaging polymers: modeling, characterization, implementation and applications [D]. Delft University of Technology, Delft, the Netherlands, 2007.