LED引线键合机中的双光路成像系统

The Double Lens Imaging System Used in LED Wire Bonder

引线键合机是半导体后封装设备中的关键技术产品,LED芯片和引脚的高度差较大,表面反光特性不同,一组镜头和光源很难获得清晰的图像,为了满足图像识别的需要,设计了一种适用于LED全自动引线键合机的双光路成像系统。识别芯片和引脚时通过一个电子切换装置自动切换到不同倍率,并配合光源的变化,大大提高了视觉系统的精确性。

Wire bonder is a key equipment of semiconductor package. There are large difference of height and surface reflectivity between LED chip and lead, so it is difficult to obtain a excellent image by a set of lens. The design that double lens imaging system used in LED wire bonder is satisfied with the demand of image identifying. Chip and lead is imaged in different magnification lens and illumination light, automatically changed by a electrical switch, It advance largely vision system precision.