摘要
简要阐述了集成电路的封装的发展趋势,对晶圆级CSP封装的现状和未来进行了简要论述。
There are many factors to affect final quality of electronic products.To most applications, the electronic packaging technology is somewhat more important than the IC design, because the reliability of products depends more and more on the packaging technology. This paper briefly describes the CSP packaging technology.
出处
《电子工业专用设备》
2008年第5期64-67,共4页
Equipment for Electronic Products Manufacturing
