强短脉冲辉光放电阴极溅射逐层分析研究

The Analysis of Sample Cathode Sputterred Surface under HCMSP GD

利用强短脉冲供电电源和一种新型的辉光放电灯联用进行阴极表面溅射，发现它与在直流供电下有不同的结果．扫描电镜进行观察，得到样品溅射表面的扫描图。结果表明，该技术为金属或合金样品表面的逐层分析提供了一种新方法．

Sample cathode sputtered under the conditions of high current and microsecond pulsed power supply can reach a finer surface, and the sputtering rate was smaller than that of the direct current mode without decreasing the spectra intensity. This will be helpful to get a higer resolution when using it as a technique to gain a surface layer profile.