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先进的ME MS封装技术及应用

The Application of Advanced ME MS Packaging Technology
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摘要 介绍了ME MS封装技术的特点和发展现状,重点介绍了圆片级、单片全集成级、MCM级、模块级、SIP级等几种很有前景的封装技术在实际中的应用,并且对ME MS封装的发展趋势进行分析. Some particularities of the MEMS（micro electromechanical system）packaging technology and the state are described. Several technologies including the MCM and SIP are especially discussed. The analyses are given for MEMS packaging technology future trends.
作者 魏兵 夏明安
机构地区 湖北工业大学机械工程学院
出处 《湖北工业大学学报》 2008年第2期16-19,共4页 Journal of Hubei University of Technology
关键词 微加速度计 微陀螺仪 数字微镜器件 RF-ME MS micro electromechanical system packaging ~ micro acceleration account micro-gyroscope digital micro-mirror device RF-MEMS
分类号 TN305.94 [电子电信—物理电子学]
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  • 4[3]O'NEAL C B, MALSHE A P, SINGH S B, et al. Challenges in the packaging of MEMS [A] . Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings.International Symposium [C] . 1999: 41-47.
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湖北工业大学学报
2008年 第2期

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