倒装片可修复底部填充材料的研究现状及发展

Development of Reworkable Underfill Materials for Flip Chip

有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。有缺陷的芯片在倒装后难以进行返工替换,使得倒装芯片技术成本提高,限制了此技术的应用。提出新型可修复底部填充材料的开发成为解决这一问题的有效途径。介绍了倒装芯片的可修复底部填充技术和可应用于可修复底部填充材料的技术要求,并综述了国内外对于可修复底部填充材料的研究现状。

Flip-chip onto organic substrate becomes a mature process with a stable structure. Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process. The issues of lack of reworkability limiting the final yield of this technology and leading to the increase of cost are analyzed. It is pointed out that reworkable underfill is the key method for addressing nonreworkability of the underfill, so it is very important for electronic packaging. Reworkable underfill technology is reviewed, target performances and recent development of reworkable underflll materials are described.