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晶圆多丝切割加工工艺参数的BP建模 被引量:1

Modeling Production of Wafer in Multi-wire Sawing
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摘要 基于现有多丝切割的理论难以解决实际加工中的工艺问题,引入了BP神经网络对切割加工工艺进行建模,经学习与训练,实例模型误差较小. Considering the fact that the existing theory of multi-wire sawing is immature to direct the production of wafer, in this paper, a new method that employ the artificial neural network in the processing modeling is suggested. Some samples are used to train the model. The result approves that the method can effectively solve the modeling problem.
出处 《常熟理工学院学报》 2008年第4期93-96,共4页 Journal of Changshu Institute of Technology
关键词 晶圆 多丝切割 工艺 神经网络 建模 multi-wire sawing technique artificial neural networks modeling
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参考文献1

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同被引文献9

  • 1桑波,葛培琪,候志坚,高玉飞.单晶硅自由磨料线锯切片过程中的流体动压效应[J].润滑与密封,2006,31(10):81-83. 被引量:4
  • 2MOLLER H J. Basic mechanisms and models of multiwire sawing [ J ]. Advanced Engineering Materials, 2004, 6(7) :501-513.
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  • 5GE P Q. The numerical analysis on action mechanism of slurry in free abrasive wiresaw slicing [ J ]. Key Engineering Materials, 2008, 359:455-459.
  • 6ZHU L Q, KAO I. Computational model for the steadystate elasto-hydrodynamic interaction in wafer slicing process using wiresaw [ J ]. International Journal of Manufacturing Technology and Management, 2005, 7 (5/ 6) :407-429.
  • 7LI J, KAO I, PRASAD V. Modeling stresses of contacts in wiresaw slicing of poly-crystalline and crystalline ingots [J ]. ASME Manufacturing Science and Technology, 1997, 6( 1 ) :430-444.
  • 8LI J, KAO I, PRASAD V. Modeling stresses of contacts in wiresaw slicing of polycrystalline and crystalline ingots [C] // Proceedings of ASME IMECE '97. Texas: ASME Press, 1997:439-446.
  • 9ZHU L Q, KAO I. Equilibrium elasto-hydrodynamic analysis in wafer slicing process using wiresaw [ C ] // Proceedings of 2001 ASME International Mechanical Engineering Congress and Exposition, New York. 2001 : 123-128.

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