硅烷膜在化学镀镍磷合金镀层上的封闭性能研究

Research on Pore Sealing of Electroless Ni-P Plating Alloy Covered with Silane Film

化学镀镍磷合金镀层在形成过程中不可避免地存在着微孔,由于以碳钢为基体的化学镀镍磷合金镀层在大多数腐蚀介质中都属阴极性镀层,微孔的存在将会导致基体的孔蚀。采用表面硅烷化方法对镍磷合金镀层进行了封闭处理,结果表明:镍磷合金镀层表面硅烷化后可以大幅提高镍磷合金镀层的抗腐蚀性能。

It is inevitable to form pore in the process of electroless Ni-P plating alloy, Ni-P plating alloy on the surface of steel belongs to cathode anticorrosion plating in mostly corrosion mediums, pore conduces steel hole corrosion. The silane film was used to seal porosity in electroless Ni-P plating alloy. The results show that the anticorrosion of electroless plating is improved dramatically after the plating covered with silane films.