低温烧结绝缘材料的研究

Study on Low-Temperature Sintering Insulation Materials

低温烧结绝缘材料是当前电子陶瓷行业迫切需要解决的问题之一。本研究采用Ａｌ２Ｏ３与Ｚｎ－Ｖ－Ｂ系易熔玻璃按一定比例在６００℃左右进行烧结，可获得具有高绝缘性（室温ρｖ＞１０１２Ω·ｃｍ，５００℃下ρｖ＞１０８Ω·ｃｍ），高抗电强度（Ｅｊ＞１５ｋＶ／ｍｍ），热稳定性好的材料，并探讨了低温烧结的机理方法和途径。

Now, it is an urgent need for electronic ceramic industry to solve the problem that insulative materials must be obtained at low sintering temperature. Materials of good insulation (ρ v>10 12 Ω·cm at room temperature, ρ v>10 8 Ω·cm at 500℃), high electric strength (E j>15kV/mm) and thermal stability can be obtained by mixing Zn-V-B low softing point glass system with Al 2O 3 at certain weight proportion. The mechanism and method of low temperaure sintering process are discussed in this paper.