改性二氧化硅溶胶的制备及成膜过程

Preparation of Modified SiO_2 Sol and the Course of the Film

采用甲基三乙氧基硅烷(MEOS)和含有C=C双键的烷氧基硅(KH-570)与正硅酸乙酯(TEOS)共同水解,合成了改性的二氧化硅溶胶,并且用提拉法在不锈钢基材上镀膜。结果表明经MEOS及KH-570改性后二氧化硅溶胶粒子明显减小,粒径分布范围变窄,对涂层具有明显增韧性效果,MEOS涂层水接触角较大,而经KH-570改性的二氧化硅涂层在有引发剂存在下,120℃热固化时可发生C=C双键的聚合交联,形成机械强度更高的有机-无机复合网络结构。

The silica sol was produced by co-hydrolysis of tetraethylorthosilicate （TEOS） and ）γ-methacryloxypropyltrimethoxysilane （KH-570） or methyl triethoxysilane （MEOS）, then the plating film was prepared on stainless steel by dip-coating method. It can be concluded that the SiO2 particle minished obviously, bound of particle diameter turned narrow and had distinct toughness with the coating. MEOS coat contact degree is very big, the SiO2 coat can form high intensity organic-inorganic hybrids when the solicitation present and the C=C double bond can polymerize by heat soliding in 120℃.