Cu-Ni-Si-Ag合金冷变形及动态再结晶研究

Investigation on cold deformation and dynamic recrystallization of Cu-Ni-Si-Ag alloy

研究了时效温度和时效时间对不同冷变形条件下Cu-2.0Ni-0.5Si-0.15Ag合金组织和性能的影响。在Gleeble-1500D热模拟试验机上,采用高温等温压缩试验,对Cu-2.0Ni-0.5Si-0.15Ag合金在高温压缩变形中的流变应力行为和组织变化进行了研究。结果表明:合金经900℃固溶,在经不同冷变形后时效,能获得较高的显微硬度与导电率,当变形量为80%,时效温度达到450℃时,其显微硬度达到220Hv,导电率达到41%IACS。热模拟实验中,应变速率和变形温度的变化强烈地影响合金流变应力的大小,流变应力随变形温度升高而降低,随应变速率提高而增大,材料显微组织强烈受到变形温度的影响。

The effect of aging temperature and aging time on microstructure and properties of Cu-2.0Ni-0.5Si-0.15Ag alloy after various deformations were studied.The flow stress behavior of Cu-2.0Ni-0.5Si-0.15Ag alloy during hot compression deformation was studied by isothermal compression test at Gleeble-1500D thermal-mechanical simulator.The results show that the high hardness and electrical conductivity of the alloy soluted at 900℃ were obtained after various cold deformation and then aged at various time.The hardness and electrical conductivity reach 220Hv and 41%IACS respectively after the alloy with 80% cold deformation and then aged at 450℃.The flow stress was controlled by both strain rate and deforming temperature,the flow stress decreases with the increase of deforming temperature,while increases with the increase of strain rate,the microstructures was strongly depended on the deformation temperature.