新型纳米银导电胶的制备及其性能研究

Study on preparation and properties of a new nano-size conductive adhesive

通过液相化学还原法制备纳米银粉,经扫描电子显微镜(SEM)和X射线衍射(XRD)表征,表明该方法制备的纳米银粉纯净,粒度分布均匀,呈短棒状。该纳米银粉作为导电填料加入可以有效地改善导电胶体系的体积电阻率和连接强度。在总银粉填充量60%,纳米银粉与微米银粉比例为1∶5的情况下,导电胶的体积电阻率达到最低值1.997×10-4Ω.cm,同时连接强度达到18.9MPa。

Nano-size silver has been successfully prepared by liquid phase reduction method,the particles were characterized by using scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The results show that the silver particles prepared by this method are pure and of short rod appearance with uniform and narrow size distribution.The resistivity and bonding strength of conductive adhesive can be effectively improved by adding nano-size silver. When conductive adhesive with 60% of the total filled quantity of silver and the scale of the nano-size silver and mirco-size silver is 1∶5,the volume resistivity can decrease to 1.997×10^-4Ω·cm,and the bonding strength can reach to 18.9MPa.