期刊文献+

X射线测量板材厚度系统研究 被引量:2

Research on technique of X-ray thickness gauge
下载PDF
导出
摘要 传统测厚系统中采用工控机或PLC,数据处理慢,人机交互性差.针对这些缺点,对AT mega 16单片机在板材测厚仪上的应用进行研究,并比较了传统的以工控机为核心的电控系统与以AT mega 16单片机为电控核心的系统的优缺点.详细介绍了测厚仪电控系统的组成和原理,同时对基于Delphi的测厚数据的处理方法进行了说明.实践表明,该系统控制结构简单,有较高的运行效率和可靠性. Conventional system of measuring thickness adopts industrial control computer or PLC, while its speed to process data is low and has poor human-machine interact capability. Aiming at these drawbacks, research on the application of AT mega 16 single chip on thickness gauge was conducted. Compare of the advantages and disadvantages of conventional electric control system taking industrial control computer as the kernel and system with AT mega 16 single chip as the electric control kernel was carried out. The composition and principle of electric control system of thickness gauge was introduced in details. Meantime, the measured thickness data process method based on Delphi was expounded. Practice indicates that control structure of this system is simple and it has high operating efficiency and reliability.
出处 《工程设计学报》 CSCD 北大核心 2008年第3期198-200,共3页 Chinese Journal of Engineering Design
关键词 X射线 测厚仪 DELPHI AVR X-Ray system of measuring thickness Delphi AVR
  • 相关文献

参考文献4

二级参考文献3

  • 1ADS1211Datasheet.Burr-Brown Corporation.Printed in USA,1997.
  • 2讯通科技.USB100Datasheet.2002.
  • 3ADVANTECH.ADAM4000 Series Data Acquisition Modules User's Manual [Z] . 2003.

共引文献8

同被引文献13

引证文献2

二级引证文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部