摘要
为了进一步提高CuCr合金的使用性能,笔者研究了挤压变形CuCr25合金的显微组织变化以及不同的时效温度和时效时间条件下CuCr25合金显微硬度和电导率的变化规律。结果表明:挤压变形后合金的显微组织均匀,晶粒大大细化;CuCr25合金挤压后经过950℃×1h固溶,在450℃时效2h可获得较好的综合性能,显微硬度可达到156HV,较铸态提高了68%,电导率可达24mS/m,较铸态提高了14%。
To further extend the application of CuCr25, the microstructure of extruded CuCr25 alloy was observed, and microhardness and electric conductivity of extruded CuCr25 alloy were also investigated after aging at different temperature and time, The results show that refined and homogeneous Cr phase is obtained, and higher microhardness and electric conductivity are gained after solid solution treatment at 950 ℃ for one hour plus aging at 450℃for two hours. After aging, the extruded CuCr25 alloy achieves the microhardness about HV156 with a 68% increase, and the electric conductivity about 24Ms/m with a 14% increase, compared with the vacuum inducing melted CuCr25 alloy.
出处
《高压电器》
CAS
CSCD
北大核心
2008年第3期225-227,231,共4页
High Voltage Apparatus
基金
新世纪优秀人才支持计划资助(资助号NCET-07-0679)
重庆工学院基金(09-60-16)资助
重庆市教育委员会科学技术研究项目(KJ080611)资助
