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应用光测技术对热载荷下金属表面裂纹扩展的研究

Optical Measure Technology on Metal Surface Displacement Under Thermal Load
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摘要 材料在加工中由于夹渣、孔洞、缝隙等原因会造成材料内部的非均匀性,在机械或热载荷下内部的缺陷将通过变形表现在外表面,即使这种变形量十分微小,数量级小于0.1μm,一般测量仪器无法测出,但对于精密微电子器件(MEMS)、精密机械等,这种缺陷是致命的。针对上述问题设计了一套专门检测材料在热载荷、机械载荷或两者耦合情况下变形的系统,并应用该系统对金属材料(LY12)表面裂纹在热载荷场下的变形进行了测量,得到了裂纹扩展的变形矢量图。该系统为一套集显微观测、数字图像处理、加载及照明等关键技术为一体的非接触、全场测量,结果可数字化输出的系统。 Usually, material shows nonlinear characteristics during processing because of having sediments, holes, and flaws etc. When under mechanical or thermal load, it will appear on its surface by deformation. This deformation is very slim, that mostly can not be inspected by common instruments. But it is fatal for MEMS, precision machine, etc. A way of noncontact optical measure technology to get displacement of surface deformation is proposed by using a micro-observation system, a skill of digital image processing, a set of constant temperature heating system and light sources. The inspection under metal material is successfully carried out by using this systern. And finally, the result of deformation vector map is obtained by using this system.
作者 陆鹏
出处 《光学与光电技术》 2008年第3期50-52,共3页 Optics & Optoelectronic Technology
基金 国家自然科学基金(10102011)资助项目
关键词 无损检测 数字图像处理 位移 non-destroyed inspection digital image processing displacement
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  • 1[1]Kotake H, and Takasu S. Quanftative Measurements of Stress in Silicon by Photoelasticity and its Application.J. Electrochem Soc.: Solid-State Sci. Technology, 1980,179-184.
  • 2[2]Spencer J. Calculating Stress and Mobility in Silicon Chips using Strain Gauge Measurement. Semieond. Eng.J. , 1981,1:34-37.
  • 3[3]Bastawros A F and Voloshin A S. Transient Thermal Strain Measurement in the Electronic Packages. Proceedings 6th Annual SEM-THERM Symposium, PHOENIX, AZ, Feb. 1990, 25-32.
  • 4[4]Guo Y, Chen W T and Lim C K. Experimental Determination of Thermal Strains in Semiconductor Packaging Using Moire Interferometry. Proc. 1992 Joint ASME/JSME Conference on Electronic Packaging, ASME Publishing, New York, 1992,779-784.
  • 5Chen D H,Eng Fract Mech,1994年,49卷,4期,517页
  • 6Lin K Y,J Fract,1976年,12卷,4期,521页

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