摘要
介绍了化学镀镍金工艺流程和工艺控制,探讨了温度对镀层沉积速率、渗金漏镀、镀层厚度的影响。提出选用高精度、高灵敏度、温度场更均匀的恒温控制设备可以显著提高化学镀镍金的品质。
The electroless nickel/immersion gold process flow and process control were introduced and the influence of temperature on deposition rate, skip plating and extraneous plating, as well as deposit thickness were discussed. The use of a temperature control system with higher precision, higher sensitivity and better uniform temperature field was suggested to improve the quality of electroless nickel/immersion gold deposit.
出处
《电镀与涂饰》
CAS
CSCD
2008年第6期25-28,共4页
Electroplating & Finishing
基金
教育部新世纪人才支持计划(NCE040826)
关键词
化学镀镍金
工艺控制
温度
electroless nickel/immersion gold （ENIG）
process control
temperature
