摘要
改善镀通孔可靠性的设计;高密度互连板测试的关键是试验设计;用紫外光改善聚酰亚胺表面及电路图形形成;有关锡须成长机理的探讨;
Designing to Improve PTH Reliability;Design for Test is the Key to Testing HDI Boards;Surface Modification of Polyimide Using UV Light and Formation of Circuit Patterns
出处
《印制电路信息》
2008年第6期72-72,共1页
Printed Circuit Information
