摘要
简述了电子封装用环氧树脂的特性以及电子封装材料目前存在的问题,综述和探讨了环氧塑封料的热膨胀性能及热应力问题。从有机改性、无机改性、纳米改性和工艺改性等几个方面,介绍了目前国内外关于环氧塑封料热膨胀性能的研究进展。
The characters of epoxy resins for electronic packaging and the present problems of electronic packaging materials are introduced briefly in this paper. The thermal stress and thermal expansion properties of epoxy molding compounds are generalized and discussed. Present studies on the progress at home and abroad of epoxy molding compounds in organic modification,inorganic modification,nanomaterials modification and process modification are also introduced.
基金
国家自然科学基金(50372027)
江苏省自然科学基金(BK2003404)
江苏省国际合作项目(BZ2004034)
关键词
电子封装
环氧树脂
线膨胀系数
复合材料
electronic packaging, epoxy resin, linear expansion coefficient, composites
