期刊文献+

深亚微米工艺下的耦合互连线的宏模型

Macromodeling of Coupling Interconnects in DSM VLSI
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摘要 利用多端口网络理论,提出了两个全新的、简单而又对称的耦合互连线宏模型。该宏模型不仅能避免模型降阶方法所产生的无源性问题和非稳定性问题,而且从试验数据和图形上还可看出,该宏模型达到了较高的精度。由于该宏模型的简单性,它可以作为子电路,方便地嵌入到流行软件如SPICE中。 This paper presents two simple and symmetrical macromodelings for coupled interconnects which are derived by applying the multi-ports theory. These new models can avoid the problems(such as low accuracy, numerical stability and possibility) which result from model order reduction. The results of examples show that all these models reach good accuracy and can work much faster than SPICE. Furthermore, it can be incorporated into SPICE frames easily for their time efficiency and better accuracy.
作者 杜建清
出处 《信息与电子工程》 2008年第3期206-212,共7页 information and electronic engineering
关键词 宏模型 耦合 ∏模型 T模型 macromodeling coupling ∏ model T model
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参考文献7

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