焦磷酸盐镀铜工艺研究

Study on the Process of the Copper Pyrophosphate Plating

通过铜镀层做基体材料的中间层或底层,可以获得许多具有特殊性能的镀层。氰化镀铜是应用最为广泛的底层镀铜工艺,但是氰化镀液中含有剧毒物.焦磷酸盐镀铜是替代氰化镀铜的最重要电镀工艺,但它的最大缺点在于附着力不好.文章用电化学方法研究了工艺条件对焦磷酸盐镀铜的镀层性能(特别是结合力)影响.结果表明:镀液的温度、搅拌速度、电流密度直接影响镀层性能;最佳工艺条件为:温度45℃,时间60 min,搅拌速度200 r/min,阴极电流密度1.5A/dm2。本研究结果为焦磷酸盐镀铜提供了实用的参考价值.

The copper coating has been used as t he middle or bottom layer of matrix material, and therefore the coating with some special properties can be obtained. Copper cyanide electroplating has been most widely used in the bottom copper plating, but the cyanide solution is severely poisonous. Copper pyrophosphate plating technology is a very important substitute of copper cyanide one, but one of the biggest problem is poor adhesion with the matrix. In this paper, by electrochemical methods, the effect of plating process on the properties （especially interaction force with the matrix） of copper coating has been studied. The results suggest that the bath temperature, stirring speed and current density affect the coating performance apparently. The optimal conditions of pyrophosphate copper electroplating are temperature （45℃）, time （60 min）, stirring speed （200 r/min）, and cathode current density （1.5 A/din2）.