铜线替代金线在晶体管封装中的压焊工艺研究

Pressure Welding Technology Research of Cu Wire Instead of Au Wire in the Transistor Seal

通过比较铜线与金线的性能,论述了铜线压焊的特点、设备的改造、铜线产品质量检验与常见不良产品等,在晶体管产量较大时,使用铜线压焊能有效地降低生产成本,因而在通用民品中有着非常广阔的应用前景。

Contrasting Cu wire with Au wire, it is discussed the characteristic of Cu wire pressure welding, the transformation of the equipment, checking quality of Cu wire product, common bad product, etc. The application prospect is very wide in the consumer field because cost of production can effectively be reduced with Cu wire pressure welding when the output of transistor is very large.