基底材料对Al-Cu-Fe共溅射薄膜的影响

Effect of Substrate Material on Co-sputtering Al-Cu-Fe Thin Films

以抛光状态的纯Al、纯Cu和不同粗糙度的不锈钢基作为基底材料,采用磁控共溅射工艺来制备Al-Cu-Fe薄膜。利用原子力显微镜、能谱仪和MTS纳米力学综合测试系统分析薄膜的表面形貌、元素含量、结合强度和摩擦系数。分析结果表明:不锈钢作为基底材料的薄膜与基体的结合强度最大,其次为纯铝和纯铜。纯铜基底薄膜的摩擦系数最大,达到0.17,其余两种薄膜的摩擦系数均低于0.03。而薄膜表面形貌与基底材料的原始形貌有直接的联系,基底原始粗糙度越细小;薄膜的表面组织也细小;基底原始粗糙度越大,薄膜表面形成的晶粒的团聚越明显。这说明基底材料对薄膜的形成有重要的影响。

Al-Cu-Fe thin films were successfully deposited by magnetron co-puttering, taking the pure Al, pure Cu with polished state and the stainless steel with different surface roughness as substrate, respectively. The surface morphologies of the films were observed by atomic force microscopy （AFM）. The element compositions of the films were analyzed by energy dispersive spectrum （EDS）, and the bonding strength and friction coefficient of the films were determined by nanoindentation （MTS Systems）. The results show that the bonding strength of the film for the stainless steel substrate is biggest, and the next is for pure Al and pure Cu. The friction coefficient of the film for pure Cu is biggest, the value of which is 0,17. The friction coefficient of the other films is lower than 0.03, The surface morphology of films is related with the initial surface morphology of the substrates. The finer the initial surface roughness of the substrates is, the finer the surface structure of films, The bigger the surface roughness of the substrate is, the coarser the grains which are formed on the surface of film are. These results show that the substrates play an important role in the formation of films.