摘要
Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected packaging materials.In this paper,the aluminum is employed as a substrate of LED,3×3 array chips are placed on the substrate,heat dissipation performance is simulated using finite element analysis(FEA)software,analyzed are the influences on the temperature of the chip with different convection coefficient,and optical properties are simulated using optical analysis software.The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency.
Thermal management is one of the key technologies for high-power Light emitting diode（LED） entering into the general illuminating field. Successful thermal management depends on optimal packaging structure and selected packaging materials. In this paper, the aluminum is employed as a substrate of LED, 3×3 array chips are placed on the substrate, heat dissipation performance is simulated using finite element analysis（FEA） software, analyzed are the influences on the temperature of the chip with different convection coefficient, and optical properties are simulated using optical analysis software. The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency.
基金
Key Scientific and Technological Research Projects of Henan Province(072102240027)
Dr Foundation of Henan Polytechnic University(648602)
Postgraduate Degree Thesis Innovation Foundation of Henan Polytechnic University(644005)
关键词
高功率LED
热量处理
光学性质
模拟
high-power LED
thermal management
optical properties
simulation
