用SU-8胶加工微结构的试验研究

Experimental Research on Fabrication of Micro-structure by Using SU-8 Photoresist

以正交实验设计为研究方法,对采用负性光刻胶（SU-8）加工高分辨率和高深宽比微结构进行了工艺研究,得出：前烘温度与前烘时间对光刻质量影响最大,对120~340μm厚的光刻胶,前烘温度取90℃,前烘时间50~120min时图形质量最佳。分析了高深宽比微结构电铸的特点,实验表明传质是微细电铸的限制性环节。实现了光刻、电铸加工微结构的工艺参数优化。

Orthogonal experimental design was applied in the research on the fabrication of high resolute micro - structure using negative photoresist （ SU - 8 ）. From experiment it can be concluded that the temperature and time of the soft bake was the most important factor of the structure quality, when the photoresist thickness ranged from 120 μm to 340μm, if the temperature and time of the soft bake was 90℃ and 50 - 120 min, means the optimal microstructure. The characteristics of the micro - electroforming process was analysed systematically. The results show that mass transfer is the limiting factor of micro - electroforming. The lithographic and micro -electroforming process was optimized.