基于辐射功率的微热板测温系统设计

Micro-hotplate temperature measurement system based on radiation power

为了解决微小芯片表面测温的难题,设计了一种非接触式微区测温系统。首先利用光纤探头和光功率计测量微热板的辐射功率,再结合辐射功率与温度的关系,精确地测出微热板表面50μm×50μm区域内的温度。实验测试结果与利用有限元分析软件Ansys得到的模拟结果基本一致,并且更换不同口径的光纤探头可以满足不同面积的样品的测量要求。

An uncontacted temperature measurement system was developed to deal with the problem of the tiny chip surface temperature measurement. The radiation power from the micro-hotplate was measured by a tiny optical fiber probe and an optical power meter. The Si-chip with the similar surface physical character as the micro-hotplate was chosen to calibrate the radiation power against the temperature. By comparing the measured radiation power with the calibration curve, the temperature of the micro-hotplate surface in the area of 50 μm × 50 μm can be discerned accurately. The proposed method has a better accuracy than the traditional ones. The measured results are in good agreement with those of the simulation by the FEA software ANSYS, and using the optical fiber probe with different apertures can meet the measurement requirement of the samples with different areas.