摘要
静电键合作为MEMS工艺中的一种重要的封装工艺,应用日益广泛。静电键合的键合时间是键合工艺中最重要的控制参数之一,但却没有统一的定义。在理论分析和一定量的实验的基础上,分析了静电键合的机理,提出以静电键合中的迁移电荷数来定义键合完成情况的理念。
An an important packing technology of MEMS technology.Static bonding has an increasing application.There is no a unique definition of the bonding time,which is one of the most control parameter of packing technology.Based on the theorteical analysis and a certain amount of experiments,the mechanism of static bonding is analyzed.In the meanwhile,the view that the numbers of electric charge migration of static bonding define the completion of static bonding is proposed in this article.
出处
《煤炭技术》
CAS
2008年第7期161-162,共2页
Coal Technology
基金
黑龙江科技学院引进高层次人才科研基金项目(07-14)资助
关键词
静电键合
键合时间
电荷
static bonding
bonding time
electric charge
