摘要
在电化学工作站上采用电偶电流测试的方法,研究以硫脲作为电位调整剂,在印刷电路板表面浸镀锡(I-Sn)的过程。采用FE-SEM观察锡镀层的显微形貌。结果证明,这种方法用来研究电路板上的浸镀金属过程是切实可行的,可以确定镀覆工艺的终了点。此方法所确定的浸镀锡工艺,可以获得致密、晶粒细小而均匀的镀层。
Immersion tin （I-Sn） on printed circuit board （PCB） was prepared by adding thiourea as the potential adjusting agent. The electrodepositing process was studied by galvanic current method using an electrochemical workstation. The effects of the immersion plating were observed by FESEM. The results show that the galvanic current method is feasible, and it can confirm the ending of the immersion plating techniques. The I-Sn procedure can be determined by means of the galvanic current method, which can produce a compact, homogenous and fine grained Sn coating.
出处
《福建工程学院学报》
CAS
2008年第3期256-259,共4页
Journal of Fujian University of Technology
基金
国家自然科学基金资助项目(50472002)
福建省国际合作重点科研项目(2002I011)
关键词
浸镀锡
电偶电流测试法
电化学工作站
显微形貌
immersion plating tin
galvanic current method
electrochemical workstation
micro morphology
