智能卡行业中影响卡体黏合强度的因素及化学分析在智能卡制作中的应用

Influence Factor of Bonding Strength in Smart Card Manufacture and Application of Chemical Analysis in Smart Card Manufacture

智能卡的加工制作过程是多层塑料薄膜的热压复合过程,其各层之间的黏合强度与制卡用塑料薄膜的相容性、薄膜材料的表面状态和洁净度有关。总结了在热压加工过程中由于各种原因,各层薄膜之间出现的层压不牢现象,并给出了几种常用的相关测试方法。

The manufacture of smart card is the lamination process of several layers of plastics films, the bonding strength between the layers are related to the compatibility, the surface appearance and the surface cleanness of the films. For various reasons in laminating, the bonding strength between the layers is too weak to bond. The reasons to induce the weak of the bonding strength are summarized, and some common and related chemical analysis methods are presented.