球栅阵列——更适合多端子LSI的表面安装式封装

Ball Grid Array:A Better Method of Surface- Mounted Package for Multi-Lead LSI

塑封球栅阵列（ＢＧＡ）是一种新型表面安装多端子型ＬＳＩ封装。与塑封四方扁平封装（ＱＦＰ）相比，前者外形更小，设备与操作较为简单，可靠性也有所提高。ＢＧＡ替代ＱＦＰ的尝试从美国开始。

PBGA(plastic ball grid array)is a novel surfacemounted package for multilead LSI.Compared with PQFP(plastic quad flat package),PBGA becomes compacter,equipment and operation of PBGA become simpler and the realiablity is higher.The try in which QFP is substituted by BGA began in USA,spreading over many countries.