摘要
目前,铜互连技术已成为超大规模集成电路的主流互连技术,铜的填充主要采用Damascene工艺进行电镀。有机添加剂一般包括加速剂、抑制剂和平坦剂,它们在电镀液中含量虽然很少,但对于铜电镀的过程非常关键。以Enthone公司的ViaForm系列添加剂为例,研究了每种类型添加剂对脉冲铜镀层性能的影响。
copper interconnect is popular technology in VLSI, Damascence process is used to palte copper.Additive include accelerator, suppressor, and leveler, it is so important in plating process,although concentration is little in plating solution .Research effect of every additive in pulse plating copper film as viaform additive of enthone company.
出处
《中国集成电路》
2008年第7期61-64,72,共5页
China lntegrated Circuit
关键词
铜互连
添加剂
脉冲电镀
粗糙度
copper interconnect,additive,pulse plating, roughness
