摘要
在多线切割中砂浆有着极其重要的作用,不同的使用条件会直接影响切割晶片的几何参数。讨论了切割线在运动中的振动效果以及对切割产生的影响,通过试验及对高速摄像机拍摄照片的分析,得出不同砂浆携带方式极其在工作中的振动会直接影响到切割出晶片几何参数的结论。
At present, the multi-wire saw have already replaced ID saw in longer ingot of semiconductor material slicing. Slurry take the most important role in slicing. Different using condition affect the geometry parameters of wafer directly. In this study, the relation between slurry actions and slicing characteristics was studied. Through the analysis of examination and pictures which shoot by high speed vidicon. We get conclusion is different slurry taken way directly affect the geometry parameters of wafer. And the processing mechanism of multi-wire saw be also studied.
出处
《电子工业专用设备》
2008年第6期39-42,共4页
Equipment for Electronic Products Manufacturing
关键词
多线切割
线振动
砂浆作用
Multi-wire saw
Frequency vibration
Slurry actions
