微量钐对银铜基合金再结晶的影响

Effect of Samarium on Recrystallization of Ag-Cu Base Alloys

研究了在银铜基合金中添加轻稀土元素钐对合金再结晶温度、再结晶激活能及再结晶速度的影响，并与添加重稀土元素钆的情况进行了比较。结果表明：在Ａｇ－Ｃｕ合金中添加０．２ｗｔ％Ｓｍ后，其再结晶温度比含铜量相同的Ａｇ－Ｃｕ和Ａｇ－Ｃｕ－０．２Ｇｄ合金均有大幅度提高；再结晶激活能高于相应的Ａｇ－Ｃｕ合金，但比Ａｇ－Ｃｕ－０．２Ｇｄ合金低；再结晶速度快于Ａｇ－Ｃｕ－０．２Ｇｄ合金且与Ａｇ－Ｃｕ合金相近。

The recrystallization process of Ag-rich Ag-Cu-0.2Sm alloys was studied by hardness measurement,differential scanning calorimetry (DSC) and optical microscope.The effect of 0.2wt%Sm on recrystallization process of Ag-Cu base alloys was compared with that of 02wt% Gd. The results show that when content of copper in alloys is the same,the recrystallization temperature of Ag-Cu-0.2Sm alloys is higher than that of Ag-Cu and Ag-Cu-0.2Gd alloys,respectively.The recrystallization speed of Ag-Cu-0.2Sm alloys is faster than that of Ag-Cu-0.2Gd alloys and is similar to that of Ag-Cu alloys.The activation energy of recrystallization of Ag-Cu-0.2Sm alloys is higher than that of Ag-Cu alloys and is lower than that of Ag-Cu-0.2Gd alloys.