期刊文献+

一种基于TDR测量的高速连接器的MMTL模型

The MMTL Model for High-Speed Connectors Based on TDR Measurement
下载PDF
导出
摘要 该文提出了一种全新的高速连接器时域模型MMTL(Multi-segment Multiple Transmission Line model)。该模型克服了MLC模型不稳定和仿真效率低的缺点,具有直观、精度可控、便于优化等优点。实验结果表明,该文所建模型精度高,与实际测量的最大误差小。 In this paper, a new SPICE model Multi-segment Multiple Transmission Line model (MMTL) is developed to model high-speed connectors based on Time Domain Reflection (TDR) measurements. This model is superior to MLC model in aspects of stabilization and efficiency. It is easy to be understood and optimized. Its accuracy can be under controlled. The excellent performance of the MMTL model is verified with experiments.
出处 《电子与信息学报》 EI CSCD 北大核心 2008年第7期1760-1762,共3页 Journal of Electronics & Information Technology
基金 国家自然科学基金(60672027) 教育部博士点基金(20050701002) 西安电子科技大学创新基金资助课题
关键词 时域测量 时域反射计 连接器 多段技术 Time domain measurement Time Domain Reflector (TDR) Connector Multi-segment technology
  • 相关文献

参考文献7

  • 1Dambach J, Ahmad M, Cashier P, and Regnier K. Development of a 10Gb I/O connector system, DesignCon 2005 [C], Santa Clara, California, 2005: 31/1-3/2.
  • 2Resso M, Modinger R, Roe J, and Gneiting T. Investigating microvia technology for 10Gbps and higher telecommunication system, DesignCon2005 [C], Santa Clara, California, 2005: 31/1-3/2.
  • 3Jong J M, Janko B, and Tripathi V. Equivalent circuit modeling of interconnects from time-domain measurements[J]. IEEE Trans. on Components, Hybrids, and Manufacturing Technology, 1993, 16(1): 119-126.
  • 4McGibney E and Barrett J. An overview of electrical characterization techniques and theory for IC packages and interconnects [J]. IEEE Trans. on Advanced Packaging, 2006, 19(1): 131-139.
  • 5Deutsch A, Surovic C W, Campbell J C, Coteus P W, Lanzetta A P, Holton J T, and Knight A D. Electrical characteristics of high-performance pin-in-socket and pad-on-pad connectors[J]. IEEE Trans. on Advanced Packaging., 1997, 20(1): 64-77.
  • 6Kao C H, Tseng C C, Ming F, and Lai M F. A Better Technique using multisegment modeling and analysis of high-density and high-speed connector [J]. IEEE Trans. on Advanced Packaging, 2006, 29(1): 140-148.
  • 7Tripathi A and Tripathi V K. A configuration-oriented SPICE model for multiconductor transmission lines in an inhomogeneous medium[J]. IEEE Trans. on Microwave Theory and Techniques, 1998, 46(12): 1997-2005.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部