摘要
概述了汽车电子用高可靠性多层板基板材料的开发。基板材料具有高贯通孔连接可靠性和高安装可靠性。
This paper describes the development of high reliability multilayer board laminate material for carrier vehicle equipment. Laminate materials have high through hole connection reliability and high mounting reliability.
出处
《印制电路信息》
2008年第7期29-33,共5页
Printed Circuit Information
关键词
汽车电子
高可靠性多层板基板材料
高贯通孔连接可靠性
高安装可靠性
carrier vehicle equipment
high reliability multilayer board laminate material
high through hole connection reliability
high mounting reliability
