摘要
阐述了使用无铅钎料存在的主要问题,包括高温带来的问题、立碑、焊点剥离、晶须以及铅污染问题等,对其中的"铅污染"问题进行了着重说明;结合军用电子产品的特殊性,明确了军品无铅化过程中所应当重视的可靠性试验;针对无铅化的特殊性问题,提出了应当增添的相应检测手段。
The main problems in using lead -free solders are discussed, including high temperature incidental problems, lift - off, tombstoning, tin whisker, Pb contamination problems and so on. Combined with the particularity of military electronical products, the reliability experimentation are presented during the process of lead - free soldering. The inspection methods for the special problems of Pb - free process are proposed.
出处
《电子工艺技术》
2008年第4期212-215,共4页
Electronics Process Technology
关键词
电子装联
无铅焊接
检测
Electronics assembly
Lead - free soldering
Inspection
