六芳基双咪唑复合光引发体系的研究及其在液态光致抗蚀剂中的应用

Study and Application on Hexaarylbiimidazole Compound Photoinitiator for Photoresist of PCB

光引发剂邻氯代六芳基双咪唑(BCIM)、增感剂4,4-二(N,N’-二甲基-氨基)苯甲酮(EMK)与4种不同的供氢体N-苯基甘氨酸(NPG)、2-巯基苯并噻唑(MBO)、2-巯基苯并咪唑(MBI)、十二烷基硫醇(RSH)组成4种复合光引发体系。通过实时红外光谱研究了供氢体种类、复合引发剂用量对光致抗蚀剂感光性能的影响,并用该复合引发体系替代传统的907/ITX光引发体系制备线路板用液态光致抗蚀剂中,研究结果表明BCIM、EMK、NPG复合光引发体系效果比传统907/ITX光引发体系有提高,所得线路板成像边缘更光滑。

Compound photoinitiator systems were composed by photoinitiator bis [-2- （o- chlorophenyl） - 4, 5 - diphenylimidazole] （BCIM） and photosensitizer N, N - his （diethylamino） benzophenone （EMK） with four different kind of hydrogen donors N- phenylglycine （NPG）, 2 - mercaptobenzothiazole （MBO）, 2 - mercaptobenzimidazole （MBI） and dodecanethiol （RSH）. The phototsensitive properties of photoresist with the dierrent hydrogen donors and photoinitiator dosage were studied by real time IR. These photoinitiator systems were applied in liquid photoresist of PCB. The results suggested that the BCIM/EMK/NPG system is the most efficient and can substitute for photoinitiator 907/ITX system which common used in photoresist of PCB.