微细铜粉在250—400℃空气中的氧化行为

OXIDATION BEHAVIOR OF FINE COPPER POWDER IN AIR BETWEEN 250—400℃

用SEM、TEM观测了微细铜粉在250—400℃空气氧化过程中的形貌和结构变化,并用热重分析仪(TGA)测试了试样的氧化增重.通过对氧化产物形貌变化的分析提出了微细铜粉中温空气的氧化历程:氧原子吸附→疏松氧化膜形成→铜离子向外迁移→氧化膜增厚.在此基础上建立了微细铜粉空气氧化增重的理论表达式,用铜粉在250—400℃间的氧化增重实验结果回归拟合了理论公式的参数,拟合结果与实验结果很好吻合.

The changes of morphology and structure of fine copper powder during oxidization process were observed by SEM and TEM, and their weight gain processes were measured by thermal gravity analyser （TGA）. Based on the experiments and some classical theories, the course of the oxidation of fine copper powder can be described as adsorption of oxygen atom → formation of porous oxide film →out diffusion of copper ion → thicking of oxide film, and a new kinetics equation was deduced to simulate the course. The analog results agree well with the data gained from the oxidation of copper between 250--400℃.