摘要
针对精炼铜在拉丝过程中容易发生断裂的情况,利用电子探针分析仪对精炼铜进行显微组织观察和元素成分分析。结果表明,精炼铜存在锡元素富集形成的黑色质点杂质和偏析使铜的晶界变得较粗。分析了该问题形成的原因,给出了解决方法。
Aiming at the circumstance that the refined copper is fracture in drawing bench process, the refined copper is carried on observing the microstructure and analyzing its composition by the electronics probe analysis instrument. The results indicate that the refined copper existences some Sn element, which accumulate and come into being black particle impurity, and which make the grain boundary of copper become more bulky obviously. The formation reason of those problems is discussed, and the resolved method is put forward.
出处
《理化检验（物理分册）》
CAS
2008年第7期389-390,394,共3页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
关键词
精炼铜
拉丝
锡富集偏析
断裂分析
Refined copper
Draw bench
Sn accumulate aliquation
Fracture analysis
